CPU-35-A/B
CPU-35-A/B
| PU Resin to be Used in Tight-Sealing for PC Boards and Water-proof of Electrical Components | |
| Introduction | Featrues : |
| "PU sealing resin is a water-proof, Solution-endurable, insulated protective film made of quality PU resin. It is used in the prevention of humidity, germs, collision, corrosion prevention of parts loosening rusting, and insulation for PC boards and electrical components. |
|
| Physical Characteristics: | ||
| Color | Transparent | |
| Specific Gravity : | Resin | 1.02 |
| Hardener | 0.97 | |
| Viscosity | Resin | 200 CPS |
| (23 degree oC) | Hardener | 1050 CPS |
| Mixing ratio | 1:1 | |
| Time available, 23 degree oC | 20 minutes | |
| Hardening Time | 23 degree oC | |
| 3 hr or 80 | ||
| degree oC | ||
| 20 minutes | ||
| Impact endurability ( MIL-1-16923D ) | -55~105 | |
| degree oC | ||
| Weight increase in water | less than 0.1% | |
| Weight loss rate ( 125 degree oC x 168hrs ) | less than 0.5% | |
| Heat conductivity ( Cal. cm/sec. cm2 , degree oC ) | 4.2 x 10-4 | |
| Hardness. Shore A | 22 | |
| Cubic resistance CHM/CM | 3.2 x 1013 | |
| Depression factor, 100,000 cycles | 0.03 | |
| Insulation constant, 100,000 cycles | 4.05 | |
| Insulation strength, VPM | 415 | |
| Heat expansion factor, 23~125 degree oC | 2.2 x 10-4/degree oC | |
| 23~40 degree oC | 1.74 x 10-4/degree oC | |
Notice:
These values are based on the test of our present laboratory test specimens