APU-7-800H (Demold time: 30-50 min)

Key feature

MDI base PU binder

Solvent free

NCO: 12±0.5

Vulcanization temperature: 120-160

Demold time: 30-50 min. 

Good bonding performance

Application

APU-7-800H is high temperature / pressure curing one component PU binder for chip foam binding. This rubber floor binder is suitable to make rubber crumb tiles for playground, running track and so on.

Description

APU-7-800H is a rubber floor binder with PUR prepolymer containing isocyanate groups on the basic of MDI (diphenyl methane diisocyanate).

Technical Data

Property

Unit

Measured value

Density at 25

g/cm3

1.08

Viscosity at 25

cps

600 - 1200

Flash point

> 200

Color

yellowish

NCO content

12±0.5

Process method

Depending on the granular size, add 7 - 15 % by weight APU-7-800H to granular. After fully mixing, pour PU binder compound into molds. Then vulcanize under 120 - 160 and pressure. Depending on the temperature and pressure, demold time will be 30-50 min.

Package

20 kg red tin.

Storage

APU-7-800H, rubber floor binder, is sensitive to humidity and should always be kept in sealed drums.

 

 

Notice: These values are based on the test of our present laboratory test specimens.